IBM System x 3250 M5 server Rack (1U) Intel® Xeon® E3 V3 Family E3-1220v3 3.1 GHz 4 GB DDR3-SDRAM 300 W

SKU
5458E4G
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System x 3250 M5 - 1x Xeon E3-1220v3 4C, 3.1GHz 8MB / 1600 DDR3 (80W), 4GB (1x 4GB (2Rx8, 1.35V) 1600MHz UDIMM), O/B 2.5" HS SAS/SATA, H1110, Multiburner, 1x300W 80+ Bronze Fixed PSU
- Enhanced performance advantages in a space-saving form factor. - Improved flexibility for faster, simpler expansion as you need it. - Entry-level server needs with IBM reliability, manageability and value. - Groundbreaking system storage density in a 1U entry-level server. - Innovative technology with the latest processors and large memory capacity, in a compact 1U footprint. - Power-efficient and 80 PLUS®-compliant design to help save energy costs. - Affordable price point and total cost of ownership. The new IBM® System x3250 M5 is the most compact rack server in the IBM System x® portfolio. Designed in a single-socket 1U form factor, it supports double the system storage density of its predecessor in the same 22-inch deep chassis—four 3.5-inch hard disk drives (HDDs) or up to eight 2.5-inch SAS/SATA HDDs.2 Choose the latest Intel processor that best matches your workloads, whether Intel Xeon E3-1200 v3 series, Core i3, or Pentium, including Xeon Data Center Graphics processors. With increasing focus on data security, the included Trusted Platform Module (TPM) can help safely store cryptographic keys. Expand with simplicity—on your timetable After activating the IBM Integrated Management Module 2 (IMM2) standard on your server, you can use IBM Feature on Demand (FoD) for several upgrades. For example, using FoD you can easily enable two more Gigabit Ethernet (GbE) ports, in addition to the two standard ports, without opening your system hardware. You can also upgrade the speed and security of the ServeRAID C100 RAID-5 upgrade within the FoD key activation system. Furthermore, by using FoD for upgrades, your two PCIe x8 expansion slots remain free for other IBM certified upgrade options as your business grows.
SKU 5458E4G
EAN 5051045159852
Specification
Processor
Thermal solution specificationPCG 2013D
Thermal Monitoring TechnologiesYes
Thermal Design Power (TDP)80 W
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
SteppingC0
Scalability1S
Processor threads4
Processor package size37.5 x 37.5 mm
Processor operating modes64-bit
Processor lithography22 nm
Processor codenameHaswell
PCI Express configurations1x8, 1x16, 2x4, 2x8
Number of QPI links1
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor1333,1600 MHz
Memory channels supported by processorDual
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum number of PCI Express lanes16
Maximum internal memory supported by processor32 GB
Idle StatesYes
Graphics & IMC lithography22 nm
FSB ParityNo
Execute Disable BitYes
Embedded options availableNo
ECC supported by processorYes
Bus typeDMI
Processor cache typeSmart Cache
Processor cache8 MB
Conflict-Free processorNo
Processor seriesIntel Xeon E3-1200 v3
Processor frequency3.1 GHz
Processor boost frequency3.5 GHz
Number of processors installed1
Processor modelE3-1220v3
System bus rate5 GT/s
Processor socketLGA 1150 (Socket H3)
Processor cores4
Processor manufacturerIntel
Motherboard chipsetIntel® C226
Maximum number of SMP processors1
Processor familyIntel® Xeon® E3 V3 Family
Memory
Internal memory4 GB
Memory layout (slots x size)1 x 4 GB
Memory slots4
Memory clock speed1600 MHz
Maximum internal memory32 GB
Internal memory typeDDR3-SDRAM
ECCYes
Storage
RAID supportYes
Optical drive typeDVD±RW
Number of HDDs supported4
Maximum storage capacity12 TB
HDD size2.5"
HDD interfaceSerial ATA, Serial Attached SCSI (SAS)
Graphics
On-board graphics card modelNot available
Maximum graphics card memory16 MB
On-board graphics cardNo
Graphics cardG200eR2
Network
LAN controllerBroadcom BCM5719
Ethernet LANYes
Ethernet interface typeGigabit Ethernet
Cabling technology10/100/1000Base-T(X)
Ports & interfaces
VGA (D-Sub) ports quantity1
USB 2.0 ports quantity6
Serial ports quantity1
Ethernet LAN (RJ-45) ports4
Expansion slots
PCI Express slots version3.0
PCI Express x8 (Gen 3.x) slots2
Optical drive
Optical drive typeDVD±RW
Design
Optical drive typeDVD±RW
Chassis typeRack (1U)
Performance
Compatible operating systemsMicrosoft Windows Server 2012 R2/ Microsoft Windows Server 2012/Microsoft Windows Server 2008 R2, Red Hat Linux, Novell SUSE Linux, VMware
Operating system installedNo
Software
Compatible operating systemsMicrosoft Windows Server 2012 R2/ Microsoft Windows Server 2012/Microsoft Windows Server 2008 R2, Red Hat Linux, Novell SUSE Linux, VMware
Operating system installedNo
Processor special features
Intel® Wireless Display (Intel® WiDi)No
Intel® Identity Protection Technology (Intel® IPT)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel® OS GuardYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel® Turbo Boost Technology2.0
Intel TSX-NIYes
Intel Trusted Execution TechnologyYes
Intel Stable Image Platform Program (SIPP)Yes
Intel® Secure KeyYes
Intel® Quick Sync Video TechnologyNo
Intel® My WiFi Technology (Intel® MWT)No
Intel® InTru™ 3D TechnologyNo
Intel® Insider™No
Intel® Hyper Threading Technology (Intel® HT Technology)No
Intel Flex Memory AccessYes
Intel Enhanced Halt StateYes
Intel Demand Based SwitchingNo
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)No
Intel Clear Video TechnologyNo
Intel® Clear Video HD Technology (Intel® CVT HD)No
Intel® Anti-Theft Technology (Intel® AT)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel 64Yes
Intel Virtualization Technology (VT-x)Yes
Intel TSX-NI version1.00
Intel Stable Image Platform Program (SIPP) version1.00
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version1.00
Intel FDI TechnologyNo
Intel Dual Display Capable TechnologyNo
Intel Fast Memory AccessYes
Processor ARK ID75052
Intel Rapid Storage TechnologyNo
CPU configuration (max)1
Power
Number of main power supplies1
Redundant power supply (RPS) supportYes
Power supply300 W
Operational conditions
Storage temperature (T-T)-40 - 60 °C
Storage relative humidity (H-H)8 - 80%
Operating temperature (T-T)10 - 35 °C
Operating altitude0 - 914 m
Technical details
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel Rapid Storage TechnologyNo
Ethernet interface typeGigabit Ethernet
CPU configuration (max)1
Chassis typeRack (1U)
PCI Express x8 (Gen 3.x) slots2
Weight & dimensions
Width435 mm
Height43 mm
Depth576 mm
Other features
Graphics cardG200eR2
CPU configuration (max)1
Manufacturer Lenovo
In Stock N
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